Recently, the “Vibration Feedback Control System for Gantry Dicing Saw” independently developed by our company has passed the substantive examination of the China National Intellectual Property Administration, and was officially granted the invention patent certificate by the China National Intellectual Property Administration on March 18, 2025.

This patent marks a significant technological breakthrough for our company in the field of high-precision CNC dicing and cutting equipment, providing innovative solutions for precision machining in new material industries such as semiconductors, photovoltaics (PV), and electronic components, etc.

The present invention pertains to the technical field of vibration measurement and control of semiconductor processing intelligent equipment - dicing saw. By providing a vibration optimization structure and feedback control system for gantry dicing saws, it solves the problems of decreased machining precision, increased tool wear, difficult integration of sensor transmission data, and incomplete data information caused by mechanical vibration in traditional dicing saws during high-speed operation. it achieves integration of dicing saw vibration and shortening of signal data treatment time, making the dicing saw characterized by high precision, high efficiency, high integration, strong adaptability, and high material utilization rate, etc.

As a National-level Specialized, Sophisticated, Distinctive, and Innovative “Little Giant” Enterprise, the acquisition of this patent also injects new momentum into promoting Hengerda's transformation and upgrading in the field of intelligent equipment. In the future, we will continue to deepen our research and innovation in the fields of intelligent equipment and its core working components (metal cutting tools) and core functional components (high-precision machine elements), accelerate the process of domestic substitution, and empower the enterprise with high-quality development through hardcore technology!